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Home > Technical Program > Plenary Speakers |
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Topic: Advanced Autonomous Robots for Automotive General Assembly
Speaker: Dr.Menassa Roland, General Motors R&D, USA
Abstract: In the 21st century, the manufacturing of complex products with multiple subcomponents, such as automobiles, will still require a significant involvement of direct human labor - readily recognized by all national economies as a great opportunity for wealth generation. Historically, assembly technologies have focused either on developing new tools, e.g. lift assist devices, that are typically limited to amplifying human effort, or on automation which replaces human effort altogether. Both approaches impose design constraints on manufacturing operations and are often associated with assembly methods that lack flexibility and adaptability. This presentation will introduce an emerging field of human-centered robotics for manufacturing systems, which relies on the use of dexterous and autonomous robotic assistants that can collaborate directly with human operators in assembly tasks. The advances required for these robots to become reality are beginning to take shape in several research laboratories around the world, and their impact will be felt in a wide range of industries and applications.
An advanced robotics strategy will be presented that looks at the near-mid-and long-term technology areas to meet the vision that one day “Humans and Robots work in harmony on the plant floor”. A qualitative framework based on four intellectual goals will be described that focuses on Object Identification, Language Understanding, Dexterity, and Social Understanding. |
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Topic: Printed Circuit Boards Manufacturing by inkjet printing
Speaker: Dr. Yongsoo Oh, Samsung Electro-Mechanics, Korea
Abstract: In recent years, manufacturing electronics with inkjet printing is investigated in order to meet the demand of various electronics manufacturers for more economical, environmentally friendly, and technically feasible patterning process. For example patterning or depositing functional layers on ever larger glass panels for LCD TV is a good example where inkjet printing can be and is being applied. One area that Samsung Electro-Mechanics has been concentrating on is to replace conventional photolithographical process to produce Printed Circuit Boards (PCB). In order to produce desirable profit margins while maintaining current standard of reliability, a dramatic change in current manufacturing philosophies and processes is required. Inkjet technology replaces the current industry standard of subtractive copper etching as a highly efficient method to produce robust circuitry on low cost substrates.
The ability of inkjet printing to pattern entire circuit lines that are simply drawn using computer graphics software makes it a very powerful and rapid production technology. Inkjet printing itself, however, is very complex, and it is not trivial to print thick micro patterned metal lines with good electrical conductivity. The desired performance is achieved by refining the inkjet triumvirate; nano-metal inks with good fluidic characteristics as well as electrical properties once cured, robust silicon MEMS printhead with precision and reliability, and a speedy mechanical system incorporating the two.
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Topic: The European perspective on the future of robotics
Speaker: Dr. Rainer Bischoff, KUKA Roboter GmbH, Germany
Abstract: Europe has a globally successful industrial robotics industry. Building on this is the next logical step for Europe to ensure that its robotics market share is maintained in industrial robots and enlarged in the newly emerging application domains. To this aim a Strategic Research Agenda (SRA) for robotics in Europe has been developed and several research projects are underway.
In the first part of this talk the SRA, which represents an aggregated and well founded position of European robotics, will be introduced. The underlying roadmapping methodology and the developed application scenarios and product visions covering a spectrum of opportunities in the different robotics application domains will be explained. Furthermore, the most important application requirements and technological challenges, which are currently faced by the established and emerging robotics industry, will be summarized.
In the second part of the talk concrete examples from recently finished and ongoing European robotics research projects will be presented, including results from projects concerned with small scale manufacturing (SMErobot), safe and dependable human-robot interaction (PHRIENDS) and service robotics (DESIRE).
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Topic: Microsystems Assembly: Leading the Way to Commercialization
Speaker: Prof. Harry E Stephanou, University of Texas at Arlington, USA
Abstract: Much of the focus in MEMS R&D has been on die level fabrication. Yet, it is commonly recognized that some 85% of total device cost is in back-end processes, such as packaging, assembly, interconnects and testing. This is partially due to the fragmented nature of the MEMS market and the lack of standard processes and tools.
The first part of this talk covers novel processes and tools aimed at back-end processing, or micromanufacturing, for cost-effective automation in relatively small batches. A modular, multiscale approach is described, as are the roles of precision engineering and microrobotics. A novel concurrent engineering paradigm enables the parallel design of products, processes and assembly tools.
The second part of the talk describes devices being manufactured using the above methodology as well as two on-going system level case studies involving the integration of distributed microsystems: a smart bandage and a microrobotic swarm.
The third part of the talk describes ARRI’s recently funded Texas MicrofactoryTM. R&D activities are being expanded with tightly coupled pilot production. This inexpensive one-stop shop provides companies with scalable micromanufacturing processes, a viable supply source, and hands-on manufacturability training for designers.
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IEEE ISAM 2009 Secretariat
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